AI technologies, coupled with the growing global demand for computational power, has accelerated the development of increasingly powerful electronic systems. Increased power consumption inevitably results in greater heat generation, creating significant thermal management challenges.
Traditional cooling methods such as air-based and passive cooling techniqes are approaching their practical limits.
As power densities continue to increase, advanced cooling technologies such as immersion cooling using dielectric fluids are being actively researched and deployed to improve heat dissipation and maintain system performance.
One of the key research challenges is understanding what occurs at the surface of a chip during the boiling process, where bubbles can be only a few microns in diameter and evolve on microsecond timescales. Capturing and quantifying these phenomena requires advanced measurement techniques with exceptionally high spatial and temporal resolution.
This is precisely the type of challenge that Dantec Dynamics’ measurement technologies are uniquely positioned to address. The ShadowSizer system was used to study the boiling process around an immerison cooled chip.
Read the application note for further details.
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