ThermechDIC

A ThermechDIC system being used to measure the Coefficient of Thermal Expansion (CTE) on an M.2 SSD Drive
Figure 1 – A ThermechDIC system being used to measure the Coefficient of Thermal Expansion (CTE) on an M.2 SSD Drive

The ThermechDIC is a complete system used for optical, non-contact, thermal testing of electronic components which include, but are not limited to:

  • Ball grid arrays (BGAs) packaging
  • Flip-chip-packaging
  • Printed circuit boards (PCBs)
  • Solid-state drives (SSDs).

The system allows for accurate (sub-micron), full-field, 3D- contour (shape), displacement, and strain measurement for the determination of the Coefficient of Thermal Expansion (CTE), warpage, and strain measured under a thermal (or cooling) load.

Measurement results are used for evaluation of the thermal mismatch (CTE) within components. Additionally, they are used for warpage analysis, which can be used for FEA validation. DIC is a technique that can process information online, in real-time, allowing data to be acquired, evaluated, and visualized within seconds (during the measurement).

The ThermechDIC system consists of the following.

  • Stereo-rig DIC system with a hot/cold stage
  • Temperature controller
  • Liquid N2 pump & controller
  • Dewar/tank

The DIC stereo-rig can be mounted on a motorized mounting frame or used in combination with a stereoscopic microscope (µDIC).

A ThermechDIC system with a stereoscopic microscope (µDIC) with vertical hot/cold stage being used to measure the strain of a 350 µm solder ball.
Figure 2 – A ThermechDIC system with a stereoscopic microscope (µDIC) with vertical hot/cold stage. The strain of a 350 µm solder ball is being measured.

The motorized mounting frame configuration (as shown in Figure 1) allows samples from 10×10 mm up to 40×40 cm in size to be measured. When BGAs or solder balls need to be measured, a stereoscopic microscope (µDIC) is required (as shown in Figure 2). This allows Fields-of-View (FoV) from 100×100 µm up to 15×15 mm to be measured. All hardware components are identical between both setup configurations. Therefore, they can be swapped and exchanged depending on the test application.

Temperature Loading Profiles

Temperature loading profiles for ThermechDIC

Temperature loading profiles, typically used for CTE and warpage measurements, are defined in the temperature controller software. A measurement profile can be defined as block function steps with temperature state conditions, additionally, the software also allows users to loop and repeat measurement profiles. Using analogue inputs provided by the temperature controller to the DAQ controller & Istra4D, the camera acquisition can be triggered at each stable temperature state. This can be programmed in Istra4D to run in parallel/sync with the temperature controller software, thus, allowing automatic measurements to be acquired.

The Thermal chip applications scripting module package for the ThermechDIC system, can be used for warpage analysis as well as coefficient of thermal expansion (CTE) measurements.

Advantages of DIC

One of the many advantages of DIC, compared to using other techniques is DIC can measure full-shape deformation in X, Y & Z and not just in the Z-direction as with shadow moiré and/or digital fringe projection (DFP). DIC can measure 3D strain, required for the determination of CTE. Furthermore, the technique can also compensate for any Rigid Body Motion (RBM) that may occur due to environmental noise/vibration.

Table 1 – Comparison of DIC to Shadow Morié, Digital Fringe Projection (DFP), and White Light Interferometry (Profilometry)

DIC is both robust and versatile, as a result, it is easily configurable with ultra-high resolution (UHRes) cameras. The resolution of DIC is dependent on the working Field-of-View (Fov) and camera resolution. Assuming a 100 mm FoV, the in-plane and out-of-plane resolution can go down to +/-0.5 µm and +/-1.0 µm, respectively.

Dantec Dynamics provides standard hot/cold stages for various component sizes. Sizes include 10×10 cm, 20×20 cm, 30×30, and up to 40×40 cm. The standard stage uses conduction heating and cooling via liquid nitrogen. Custom hot/cold stages can also be manufactured using convection heating as well as a closed coolant circulation via a chiller. Hot/cold stages allow users to perform measurements from -80°C to 400°C. Temperature uniformity is +/-0.1°C per cm (>25°C). The temperature controller consists of a 24-bit analogue-to-digital converter with a temperature control stability of +/-0.05°C (>25°C).

Hot/cold stage with temperature controller for ThermechDIC
Figure 4 – Hot/cold stage with temperature controller

Components

FEA Validation

FEA Validation

The FEA Validation Tool, is a free-of-charge plugin that allows users the possibility to import measurement data from an Istra4D DIC system into AnsysTM for validation against FEA results
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Camera Technology

Camera Technology

At Dantec Dynamics, we embrace, integrate and support the very latest in what camera technology has to offer so you can do more with DIC.
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PC & Hardware components

PC & Hardware components

We have a wide portfolio of standardized PCs and hardware components, including; Tower PCs, DAQ Controllers, Network Cards and FrameGrabbers
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Calibration Targets

Calibration Targets

A calibration target is a reference object that consists of a defined shape grid pattern manufactured to a surface.
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Speckle Pattern Application

Speckle Pattern Application

DIC uses a contrasting, speckle pattern as the information source for the correlation algorithm. The performance of the correlation is, among other things, dependent on the quality of the speckle pattern.
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Illumination Systems

Illumination Systems

Illumination systems vary in wavelength, illuminance output and optics. The selection of the most appropriate system is dependent on the measurement test application.
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Application Scripting and Modules

Application Scripting and Modules

The Istra4D DIC application scripting functionality allows users to initiate custom, numerical computations of application data series.
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DIC Basic User Training

DIC Basic User Training

The DIC Basic User Training Course 1.0 is the latest edition to Dantec Dynamics‘ eLearning courses. Users can now can get complete, unlimited access to this training course, anytime & anywhere
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Support & eLearning

Support & eLearning

We support and assist users in the operation of our DIC systems with your respective measurement application via the following six mediums.
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VDE 2626: Pre-Acceptance Test

VDE 2626: Pre-Acceptance Test

VDI/VDE 2626 is a standard practise that describes a general procedure for performing an accetptance & interim check for a stereoscopic Digital Image Correlation (DIC) setup.
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Stereoscopic Microscope

Stereoscopic Microscope

A 2-camera 12 Mpx system can be retrofitted with a stereoscopic microscope for object size measurement from 100×100 µm up to 15×15 mm
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Application Notes

Electronics Component (Thermal) Testing Applications – Video

Electronics Component (Thermal) Testing Applications – Video

In this applications video, we show various applications of how the ThermechDIC system can be used for the…
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Biomechanics & Biomaterials Testing Applications – Video #1

Biomechanics & Biomaterials Testing Applications – Video #1

In this video, we present an overview of Biomechanics & Biomaterials Testing Applications, specifically focusing on Bones, Implants…
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Application Scripting Module – Infrared (IR) Camera Analysis – Video

Application Scripting Module – Infrared (IR) Camera Analysis – Video

Here is an example of the Infrared (IR) applications modules for the comparison and analysis of temperature and…
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Measurement of the CTE and Warpage for Microscopic Electronic Components

Measurement of the CTE and Warpage for Microscopic Electronic Components

Mold shrinkage and CTE mismatch leads to Warpage in Electronic Components. This application note shows how a DIC…
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CTE & Warpage Measurements of Electronic Packaging

CTE & Warpage Measurements of Electronic Packaging

Mold shrinkage and CTE mismatch leads to Warpage in Electronic Components. This application note shows how a DIC…
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Application Scripting Module – Thermal Chip – Video

Application Scripting Module – Thermal Chip – Video

Here is an example of the thermal chip analysis applications modules for the measurement of the coefficient of…
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