ThermechDIC

Figure 1 – A ThermechDIC system being used to measure warpage of a chip (visualization from middle camera is hidden on Laptop PC )

The ThermechDIC is a complete Digital Image Correlation (DIC) and warpage measurement system used for optical, non-contact, thermal testing of electronic components, including but not limited to:

  • Ball grid arrays (BGAs) packaging
  • Flip-chip-packaging
  • Printed circuit boards (PCBs)
  • Solid-state drives (SSDs).

The system allows for accurate (sub-micron), full-field, 3D- contour (shape), displacement, and strain measurement for the determination of the Coefficient of Thermal Expansion (CTE), warpage, and strain measured under a thermal (or cooling) load.

The ThermechDIC is applicable measurement technology for the following standards;

  • JESD22-B112B (Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature)
  • JEITA ED-7306 (Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

    The ThermechDIC system consists of a 3-camera Digital Image Correlation (DIC) system, together with mounting with a; hot/cold stage, temperature controller, liquid N2 cooling system, and Dewar (Liquid N2 tank). Standardized components of the system include; Cameras & Lenses, DAQ Controller, Illumination System, Calibration Targets, and Laptop PC.

    Figure 2 – A ThermechDIC system being used to measure warpage of a chip (visualization from middle camera is hidden on Laptop PC)

    The ThermechDIC can be mounted on either a; vertical mounting frame for sample sizes from 10×10 mm up to 40×40 cm, or a stereoscopic microscope for sample sizes from 100×100 µm up to 15×15 mm. All hardware components are otherwise identical between both setup configurations and as such, can be swapped and exchanged depending on application.

    Figure 3 – A ThermechDIC system with a stereoscopic microscope being used to measure the Coefficient of Thermal Expansion (CTS) of a chip.

    Temperature Loading Profiles

    Temperature loading profiles for ThermechDIC
    Figure 4 –  An example of a temperature loading profile

    Temperature loading profiles can be defined in the temperature controller software as block function steps with temperature state conditions (such as, ramp, hold & wait). A profile can also be looped (i.e. repeated) for cyclic thermal loading. Using analogue inputs provided by the temperature controller to the DAQ controller, users can define a recording procedure in Istra4D that executes camera acquisition triggers at each stable temperature state. This can all be programmed in Istra4D to run in parallel/sync with the temperature controller software, allowing automatic thermal cyclic loading measurements to be acquired.

    Advantages of DIC

    One of the many advantages of DIC, compared to using other techniques is DIC can measure full-shape deformation in X, Y & Z and not just in the Z-direction as with shadow moiré and/or digital fringe projection (DFP). DIC can measure 3D strain, required for the determination of CTE. Furthermore, the technique can also compensate for any Rigid Body Motion (RBM) that may occur due to environmental noise/vibration.

    Table 1 – Comparison of DIC to Shadow Morié, Digital Fringe Projection (DFP), and White Light Interferometry (Profilometry)

    DIC is both robust and versatile, as a result, it is easily configurable with ultra-high resolution (UHRes) cameras. The resolution of DIC is dependent on the working Field-of-View (Fov) and camera resolution. Assuming a 100 mm FoV, the in-plane and out-of-plane resolution can go down to +/-0.5 µm and +/-1.0 µm, respectively.

    Dantec Dynamics provides standard hot/cold stages for various component sizes. Sizes include 10×10 cm, 20×20 cm, 30×30, and up to 40×40 cm. The standard stage uses conduction heating and cooling via liquid nitrogen. Custom hot/cold stages can also be manufactured using convection heating as well as a closed coolant circulation via a chiller. Hot/cold stages allow users to perform measurements from -80°C to 400°C. Temperature uniformity is +/-0.1°C per cm (>25°C). The temperature controller consists of a 24-bit analogue-to-digital converter with a temperature control stability of +/-0.05°C (>25°C).

    Figure 5 – A hot/cold stage with temperature controller, LiN2 pump and dewar (LiN2 tank)

    Components

    FEA Validation

    FEA Validation

    The FEA Validation Tool, is a free-of-charge plugin that allows users the possibility to import measurement data from an Istra4D DIC system into AnsysTM for validation against FEA results
    LEARN MORE

    Camera Technology

    Camera Technology

    At Dantec Dynamics, we embrace, integrate and support the very latest in what camera technology has to offer so you can do more with DIC.
    LEARN MORE

    DAQ Controllers

    DAQ Controllers

    A Data Acquisition (DAQ) Controller allows cameras to be synchronized & triggered with external measurement devices, input signals, and output real-time DIC data.
    LEARN MORE

    PCs & Hardware

    PCs & Hardware

    We have a wide portfolio of standardized PCs and hardware components, including; Laptop & Tower PCs, Network Cards and FrameGrabbers
    LEARN MORE

    Calibration Targets

    Calibration Targets

    A calibration target is a reference object used to calibrate the projection of a DIC experiment. We offer ceramic and aluminium honeycomb targets.
    LEARN MORE

    Speckle Pattern Application

    Speckle Pattern Application

    DIC uses a contrasting, speckle pattern as the information source for the correlation algorithm. The performance of the correlation is, among other things, dependent on the quality of the speckle pattern.
    LEARN MORE

    Illumination Systems

    Illumination Systems

    Illumination systems vary in wavelength, illuminance output and optics. The selection of the most appropriate system is dependent on the measurement test application.
    LEARN MORE

    Application Scripting and Modules

    Application Scripting and Modules

    The Istra4D DIC application scripting functionality allows users to initiate custom, numerical computations of application data series.
    LEARN MORE

    DIC Basic User Training

    DIC Basic User Training

    The DIC Basic User Training Course 1.0 is the latest edition to Dantec Dynamics‘ eLearning courses. Users can now can get complete, unlimited access to this training course, anytime & anywhere
    LEARN MORE

    Support & eLearning

    Support & eLearning

    We support and assist users in the operation of our DIC systems with your respective measurement application via the following six mediums.
    LEARN MORE

    VDE 2626: Pre-Acceptance Test

    VDE 2626: Pre-Acceptance Test

    VDI/VDE 2626 is a standard practise that describes a general procedure for performing an accetptance & interim check for a stereoscopic Digital Image Correlation (DIC) setup.
    LEARN MORE

    Stereoscopic Microscope

    Stereoscopic Microscope

    A 2-camera 12 Mpx system can be retrofitted with a stereoscopic microscope for object size measurement from 100×100 µm up to 15×15 mm
    LEARN MORE

    Application Notes

    Electronics Component (Thermal) Testing Applications – Video

    Electronics Component (Thermal) Testing Applications – Video

    In this applications video, we show various applications of how the ThermechDIC system can be used for the…
    LEARN MORE

    Biomechanics & Biomaterials Testing Applications – Video #1

    Biomechanics & Biomaterials Testing Applications – Video #1

    In this video, we present an overview of Biomechanics & Biomaterials Testing Applications, specifically focusing on Bones, Implants…
    LEARN MORE

    Application Scripting Module – Infrared (IR) Camera Analysis – Video

    Application Scripting Module – Infrared (IR) Camera Analysis – Video

    Here is an example of the Infrared (IR) applications modules for the comparison and analysis of temperature and…
    LEARN MORE

    Measurement of the CTE and Warpage for Microscopic Electronic Components

    Measurement of the CTE and Warpage for Microscopic Electronic Components

    Mold shrinkage and CTE mismatch leads to Warpage in Electronic Components. This application note shows how a DIC…
    LEARN MORE

    CTE & Warpage Measurements of Electronic Packaging

    CTE & Warpage Measurements of Electronic Packaging

    Mold shrinkage and CTE mismatch leads to Warpage in Electronic Components. This application note shows how a DIC…
    LEARN MORE

    Application Scripting Module – Thermal Chip – Video

    Application Scripting Module – Thermal Chip – Video

    Here is an example of the thermal chip analysis applications modules for the measurement of the coefficient of…
    LEARN MORE

    Download Library

    TITLE
    DOWNLOAD FILE

    Learn more about the ThermechDIC system today

    Our global network of friendly and knowledgeable distributors is standing by to discuss your testing needs.