Electronic Components Thermal Testing

Electronic components are essential to modern day life. They are used in everything from consumer products, to automotive entertainment systems, and to communication networks. The growing demand for components to be smaller, lighter and thinner via miniturization and higher-density packaging places greater requirements on performance & reliaibility.

The heat treatment process during production and changes in ambient & internal temperature during operation causes expansion and contraction, that induce warpage, within electronic components.

Since the majority of components consist of different materials, it is normal that thermal stresses develop along the connection interface due to material mismatch of the thermal expansion coefficients. As such, the testing of electronic components, after production and in active operation, is important to ensure product reliability under thermal loading.

Digital Image Correlation (DIC) is a non-contact, full-field, optical measurement technology that can be used to measure surface (contour) shape, displacement and strain yielding an in-plane and out-of-plane accuracy of between 1-5 µm. A stereoscopic DIC system used in conjunction with a heating stage can be used to measure thermal warpage (contour & displacement), but also the thermal strain and the coefficient of thermal expansion (CTE) in any optically visible component.

Figure 1: 2D-overlay visualization of displacement (Z) in micrometers at a temperature level with four line gauges

Application Notes

Electronics Component (Thermal) Testing Applications – Video

In this applications video, we show various applications of how the ThermechDIC system can be used for the thermal testing of electronic components for warpage analysis and corefficient of t[…]
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Application Scripting Module – Infrared (IR) Camera Analysis – Video

Here is an example of the Infrared (IR) applications modules for the comparison and analysis of temperature and DIC measurements (displacement & strain)
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Measurement of the CTE and Warpage for Microscopic Electronic Components

Mold shrinkage and CTE mismatch leads to Warpage in Electronic Components. This application note shows how a DIC TCT system with a stereoscopic microscope can be used to measure the Coeffici[…]
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CTE & Warpage Measurements of Electronic Packaging

Mold shrinkage and CTE mismatch leads to Warpage in Electronic Components. This application note shows how a DIC TCT system can be used to measure the Coefficient of Thermal Expansion (CTE) […]
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Application Scripting Module – Thermal Chip – Video

Here is an example of the thermal chip analysis applications modules for the measurement of the coefficient of thermal expansion (CTE) and warpage (contour and displacement).
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Basics of 3D Digital Image Correlation (DIC)

In classical image correlation the deformation of an object is determined by observation with a CCD camera. Then a digital image correlation process determines the shift and/or rotation and […]
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More Information

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