In this application video, a 2-cam (5 Mpx) ThermechDIC system is used to measure the
Coefficient of thermal expansion (CTE) of a Cu-ETP. The theoretical reference CTE of the
Cu-ETP plate is 17.7×10^-6/K.
In the measurement, the Cu-ETP was heated up & down, using a hot/cold stage, from RT
to 270°C in multiple step (states). The recorded (analogue input) temperature was saved
together with the images and can be seen at the bottom of the screen in the measurement
series acquisition.
Within the graphical visualization, a 2D-overlay of the total displacement (in mm) can be seen
together with a temporal plot of the temperature and the mean strain (over a polygon virtual
gauge). It is clear that the peak displacement and strain (4.5 mstrain) occur both at the peak
temperature, which is to be expected.
For determination of the CTE, the (ready-made) plug-in application scripting modules can be
utilized. Simply execute, the required application module from the “Modules” tab in the graphical
visualization and the module will open. Selection of the temperature level states for the CTE can
be made and then finally, the range for which the CTE is to be calculated.
The measured CTE was 17.68×10^-6/K – a difference of 0.02 between the measured and theoretical result.
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