The 27th Int. Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems We will be showcasing a ThermechDIC system for optical, non-contact, thermal testing of electronic components. Come and see us at our booth and let us show you our latest news!
We are exhibiting at the MRO Americas 2026 in Orlando, USA Come and see us, and let us show you our latest news! Venue: Orange County Convention Center Orlando, FL, USA
Come and meet us at the meeting and let us show you our latest news. Venue: Dalhousie Building, University of Dundee, Old Hawkhill, Dundee DD1 5EN
Come and meet us and let us show you our latest news. Venue: DisCoVor will be hosted by the University of Edinburgh at the School of Engineering on the university’s historic campus, with the main colloquium sessions taking place in the iconic Playfair Library.
Come and meet us at the congress and let us show you our latest news. Venue: Kulturens hus - House of Culture in central Luleå Skeppsbrogatan 17 971 79 Luleå Sweden
16 – 18 Tonsbakken
DK-2740 Skovlunde, Denmark
CVR: 15107588
ISO 9001:2015
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