Image stress with 1mK sensitivity thanks to TSA

We are proud to announce the release of our new Thermoelastic Stress Analysis (TSA) portfolio.

TSA is an optical, non-contact measurement technique that employs a thermal imaging sensor with an advanced image processing algorithm to convert thermo-elastically induced temperature changes into an image of surface stress.

TSA measurement results showing the surface stress of a; coupon sample with a waterjet cutout of the Dantec Dynamics “D-logo” (left) and bending stress of a truss (right)
 

The ThermoESA is a Thermoelastic Stress Analysis (TSA) measurement system that offers the advanced, in-situ, stress visualisation capability of a high-end R&D instrument with the ruggedness, versatility, and ease-of-use of an industrial tool. The innovative approach behind the ThermoESA is the use of a single compact and rugged uncooled LWIR (Long Wave Infrared) camera together with sophisticated signal processing, and custom-built timing electronics to achieve a ground-breaking thermal sensitivity of less than 1 mK (millikelvin).

ThermoESA System
 ThermoESA sensor measuring stress on a coupon in a tensile test

Packaged with the ThermoESA system is the powerful MiTE Suite software package, offering a comprehensive set of tools for advanced stress imaging and analysis. The MiTE Suite delivers a range of features, including:

  • Full complex-valued thermoelastic response
  • Real-time display of visual and infrared image
  • Semi real-time display (user selectable frame rate) of thermoelastic effect
  • Plotting functions
  • Point and RoI metrics
  • Stress & temperature change calibration

To find out more information about our Thermoelastic Stress Analysis (TSA) click here