The Q-400 μDIC system is specially designed for measurement of warpage and thermal expansion within the micro-electronics/components industry working with electronic miniaturization and high-density package design. The solution helps to measure the precise deformation in cases where simulations are not possible or testing is a necessity. The solution comes as a complete system with stereo microscope, illumination, heating/cooling stage, 5 megapixel cameras and user friendly measurement software.
The system provides easy and fast full-field 3D deformation and strain analysis. The results include complete shape, deformation and strain data, temporal and spatial plots, data of virtual strain gauges, STL data for CAD processing, as well as images and movies for presentation purposes.
The result is easy and fast FEM validation and CTE determination through real-time image correlation of shape, deformation and strain with sub-micron accuracy. Setup, focusing, and calibration are easy and smooth allowing you to focus on what really matters: 3D warpage measurements that have never been easier.
Digital Image Correlation (DIC) is a full-field image analysis method, based on grey value digital images, that can determine the contour and the displacements of an object under load in three dimensions.