The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
The system is ideal for the experimental
verification of analytical and numerical calculations. The 3D information
enables fast determination of warpage, thermal expansion coefficient and the
thermal stress of components such as printed circuits, BGA, Flip Chips etc.
The DIC TCT system is a complete package for thermal investigations, enabling non-contact measurement performed on the whole measuring area on nearly any material. 3D information can also be provided on curved surfaces. Warpage measurements are also possible.
Measurement Principle
Digital Image Correlation (DIC) is a full-field image analysis method, based on grey value digital images, that can determine the contour and the displacements of an object under load in three dimensions.
Components
At Dantec Dynamics, we embrace, integrate and support the very latest in what camera technology has to offer so you can do more with DIC.
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Illumination systems vary in wavelength, illuminance output and optics. The selection of the most appropriate system is dependent on the measurement test application.
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The DIC Basic User Training Course 1.0 is the latest edition to Dantec Dynamics‘ eLearning courses. Users can now can get complete, unlimited access to this training course, anytime & anywhere
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DIC uses a contrasting, speckle pattern as the information source for the correlation algorithm. The performance of the correlation is, among other things, dependent on the quality of the speckle pattern.
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A calibration target is a reference object that consists of a defined shape grid pattern manufactured to a surface.
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The Istra4D DIC application scripting functionality allows users to initiate custom, numerical computations of application data series.
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We support and assist users in the operation of our DIC systems with your respective measurement application via the following six mediums.
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VDI/VDE 2626 is a standard practise that describes a general procedure for performing an accetptance & interim check for a stereoscopic Digital Image Correlation (DIC) setup.
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We have a wide portfolio of standardized PCs and hardware components, including; Tower PCs, DAQ Controllers, Network Cards and FrameGrabbers
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Application Notes
In this applications video, we show various applications of how the ThermechDIC system can be used for the…
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In this video, we present an overview of Biomechanics & Biomaterials Testing Applications, specifically focusing on Bones, Implants…
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Here is an example of the Infrared (IR) applications modules for the comparison and analysis of temperature and…
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Mold shrinkage and CTE mismatch leads to Warpage in Electronic Components. This application note shows how a DIC…
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Mold shrinkage and CTE mismatch leads to Warpage in Electronic Components. This application note shows how a DIC…
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Here is an example of the thermal chip analysis applications modules for the measurement of the coefficient of…
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Learn more about the DIC TCT system today
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