The 3D ESPI System Q-300 enables complete three dimensional and highly sensitive deformation and strain analysis of any component.
The measurement is performed on the whole measuring field without contact. No marking is required on the measured object. With its unprecedented compactness, the system’s sensor head offers convenient portability and flexible set-up for any material measurement task.
The Q-300 is best suited for the development and testing of complex components and structures in electronics, automobile design, machining and materials research. It is ideal for the experimental verification of analytical and numerical calculation techniques.
The fully portable Q-300 is symmetrically designed, with interchangeable laser illumination arms to maintain different illumination base lengths and sensitivities.
The Q-300 can be operated in the 1D-, 2D- or 3D-mode without loss of accuracy. The built-in zoom lens enables adaptation to different object sizes and geometries. With macro lenses, very small areas can be analyzed as well.
The sensor is driven by a ruggedized electronic control system with the complete software package ISTRA for Windows. It offers automatic and manual measurement and quantitative data analysis of 3D-displacement and strain fields.
Maximum measuring accuracy is guaranteed by taking into account the varying sensitivity with different object coordinates. Therefore, the complete geometry matrix is recalculated automatically by the ISTRA software for every object point.
- Full field, 3-dimensional measurement without contact and marking
- Delivers Young’s Modulus and Poisson Ratio
- Measurement of any material, both isotropic and anisotropic
|Measuring Sensitivity:||0.03 – 1 µm adjustable|
|Measuring Range:||Adjustable to any measurement range by variation of measurement steps (10 – 100 µm per step depending on measuring direction)|
|Measuring area:||up to 200 x 300 mm2 (8″x12″) larger areas with external laser|
|Operation modes:||automatic, manual, 1D, 2D, 3D operation|
|Data interface:||TIFF, ASCII, Windows metafile>|
|Data acquisition speed:||3.5 seconds for 3D analysis|
|Data analysis:||automatic serial analysis or manual at any loading step|
|Base length of illumination:||min. 120 mm (4.7″)|
|Dimensions of sensor head (without arms):||80 x 80 x 120 mm3 (3.1″ x 3.1″ x 4.7″)|
|Weight:||2.5 kg (5.5 lbs) (total sensor)|
|Laser (built-in):||diode, 2 x 75 mW, 785nm|
|Operating system:||Windows 2000, XP|