MicroDIC

Image of Q400 Micro DIC system

The Q-400 μDIC system is specially designed for measurement of warpage and thermal expansion within the micro-electronics/components industry working with electronic miniaturization and high-density package design. The solution helps to measure the precise deformation in cases where simulations are not possible or testing is a necessity. The solution comes as a complete system with stereo microscope, illumination, heating/cooling stage, 5 megapixel cameras and user friendly measurement software.

The system provides easy and fast full-field 3D deformation and strain analysis. The results include complete shape, deformation and strain data, temporal and spatial plots, data of virtual strain gauges, STL data for CAD processing, as well as images and movies for presentation purposes.

The result is easy and fast FEM validation and CTE determination through real-time image correlation of shape, deformation and strain with sub-micron accuracy. Setup, focusing, and calibration are easy and smooth allowing you to focus on what really matters: 3D warpage measurements that have never been easier.

Components

Speckle Pattern Application

Speckle Pattern Application

DIC uses a contrasting, speckle pattern as the information source for the correlation algorithm. The performance of the correlation is, among other things, dependent on the quality of the speckle pattern.
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Calibration Targets

Calibration Targets

A calibration target is a reference object that consists of a defined shape grid pattern manufactured to a surface.
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Application Scripting and Modules

Application Scripting and Modules

The Istra4D DIC application scripting functionality allows users to initiate custom, numerical computations of application data series.
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