DIC TCT

Image of Q400 DIC-TCT system

The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.

The system is ideal for the experimental verification of analytical and numerical calculations. The 3D information enables fast determination of warpage, thermal expansion coefficient and the thermal stress of components such as printed circuits, BGA, Flip Chips etc.

The DIC TCT system is a complete package for thermal investigations, enabling non-contact measurement performed on the whole measuring area on nearly any material. 3D information can also be provided on curved surfaces. Warpage measurements are also possible.

Components

Illumination Systems

Illumination Systems

Illumination systems vary in wavelength, illuminance output and optics. The selection of the most appropriate system is dependent on the measurement test application.
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DIC Basic User Training

DIC Basic User Training

The DIC Basic User Training Course 1.0 is the latest edition to Dantec Dynamics‘ eLearning courses. Users can now can get complete, unlimited access to this training course, anytime & anywhere
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Camera Technology

Camera Technology

At Dantec Dynamics, we embrace, integrate and support the very latest in what camera technology has to offer so you can do more with DIC.
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Speckle Pattern Application

Speckle Pattern Application

DIC uses a contrasting, speckle pattern as the information source for the correlation algorithm. The performance of the correlation is, among other things, dependent on the quality of the speckle pattern.
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Calibration Targets

Calibration Targets

A calibration target is a reference object that consists of a defined shape grid pattern manufactured to a surface.
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Application Scripting and Modules

Application Scripting and Modules

The Istra4D DIC application scripting functionality allows users to initiate custom, numerical computations of application data series.
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Support & eLearning

Support & eLearning

We support and assist users in the operation of our DIC systems with your respective measurement application via the following six mediums.
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VDE 2626: Pre-Acceptance Test

VDE 2626: Pre-Acceptance Test

VDI/VDE 2626 is a standard practise that describes a general procedure for performing an accetptance & interim check for a stereoscopic Digital Image Correlation (DIC) setup.
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Application Notes

Electronics Component (Thermal) Testing Applications – Video

Electronics Component (Thermal) Testing Applications – Video

In this applications video, we show various applications of how the ThermechDIC system can be used for the…
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Biomechanics & Biomaterials Testing Applications – Video #1

Biomechanics & Biomaterials Testing Applications – Video #1

In this video, we present an overview of Biomechanics & Biomaterials Testing Applications, specifically focusing on Bones, Implants…
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Application Scripting Module – Infrared (IR) Camera Analysis – Video

Application Scripting Module – Infrared (IR) Camera Analysis – Video

Here is an example of the Infrared (IR) applications modules for the comparison and analysis of temperature and…
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Measurement of the CTE and Warpage for Microscopic Electronic Components

Measurement of the CTE and Warpage for Microscopic Electronic Components

Mold shrinkage and CTE mismatch leads to Warpage in Electronic Components. This application note shows how a DIC…
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CTE & Warpage Measurements of Electronic Packaging

CTE & Warpage Measurements of Electronic Packaging

Mold shrinkage and CTE mismatch leads to Warpage in Electronic Components. This application note shows how a DIC…
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Application Scripting Module – Thermal Chip – Video

Application Scripting Module – Thermal Chip – Video

Here is an example of the thermal chip analysis applications modules for the measurement of the coefficient of…
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