The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
The system is ideal for the experimental verification of analytical and numerical calculations. The 3D information enables fast determination of warpage, thermal expansion coefficient and the thermal stress of components such as printed circuits, BGA, Flip Chips etc.
The DIC TCT system is a complete package for thermal investigations, enabling non-contact measurement performed on the whole measuring area on nearly any material. 3D information can also be provided on curved surfaces. Warpage measurements are also possible.