For today’s demands of high reliability, durability, and environmental performance on machines, electronics, or mechanical components, static measurements of stress/strain properties are not sufficient and dynamic measurements are necessary.
Vibration Analysis (VA) via Digital Image Correlation (DIC) is ideally suited for measuring dynamic material deformation and strain.
Application Notes
Application Scripting Module – Vibration Analysis (ODS, OMA & EMA) – Video
Here is an example of the vibration analysis applications module for operation modal analysis (OMA), experimental modal analysis (EMA) and operation deflection & shape (ODS) analysis for the[…]
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Application Scripting Module – Vibration Analysis – Video
Here is an example of the vibration analysis applications module for the modal shape analysis (FFT) of one or multiple points.
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Dantec’s High Speed Digital Image Correlation (DIC) for Vibration and Modal Shape Analysis
For todays demands on highest reliability, durability and environmental performance of machines, electronics or mechanical components, static measurements of stress/strain properties are[…]
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Basics of 3D Digital Image Correlation (DIC)
In classical image correlation the deformation of an object is determined by observation with a CCD camera. Then a digital image correlation process determines the shift and/or rotation and […]
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