Electronic Components

Electronic components are used in the automotive, communication, aerospace and other industries. Miniaturization, higher package density and accelerated development processes have a great impact on the reliability of electronic components.

Rapid changes of ambient temperature or internal production of heat may occur during operation. This may create high thermal stresses due to the mismatch of the thermal expansion coefficients of the different materials in electronic components.

Shrinking dimensions of flip chip assemblies make inspection of bumps or solder joints always more difficult as standard non destructive control techniques reach their resolution limits.

Electronic speckle pattern interferometry (ESPI) as a non-contact, full-field and 3-dimensional measuring method copes well with the challenge of deformation measurements on microsystems and electronic components with a sub-micron resolution.

image of Electronics-components

Application Notes

Residual Stress Measurement with ESPI Hole Drilling Method

Electronic components are used in the automotive, communication, aerospace and other industries. Miniaturization, higher package density and accelerated development processes have a great im[…]
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Thermal Expansion of Electronic Components

Electronic components are used in the automotive, communication, aerospace and other industries. Miniaturization, higher package density and accelerated development processes have a great im[…]
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Thermal Expansion of Ball Grid Arrays

Electronic components are used in the automotive, communication, aerospace and other industries. Miniaturization, higher package density and accelerated development processes have a great im[…]
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Non Destructive Control of Flip Chip Packages

Flip chip is an interconnection technology where a face-down (or “flipped”) electronic components is both mechanically and electrically connected to its substrate in a one step process by me[…]
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Basics of 3D Digital Image Correlation (DIC)

In classical image correlation the deformation of an object is determined by observation with a CCD camera. Then a digital image correlation process determines the shift and/or rotation and […]
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