Electronic Components

Electronic components are used in the automotive, communication, aerospace and other industries. Miniaturization, higher package density and accelerated development processes have a great impact on the reliability of electronic components.

Rapid changes of ambient temperature or internal production of heat may occur during operation. This may create high thermal stresses due to the mismatch of the thermal expansion coefficients of the different materials in electronic components.

Shrinking dimensions of flip chip assemblies make inspection of bumps or solder joints always more difficult as standard non destructive control techniques reach their resolution limits.

Electronic speckle pattern interferometry (ESPI) as a non-contact, full-field and 3-dimensional measuring method copes well with the challenge of deformation measurements on microsystems and electronic components with a sub-micron resolution.

image of Electronics-components

Application Notes

Application Scripting Module – Infrared (IR) Camera Analysis – Video

Here is an example of the Infrared (IR) applications modules for the comparison and analysis of temperature and DIC measurements (displacement & strain)
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Measurement of the CTE and Warpage for Microscopic Electronic Components

Mold shrinkage and CTE mismatch leads to Warpage in Electronic Components. This application note shows how a DIC TCT system with a stereoscopic microscope can be used to measure the Coeffici[…]
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CTE & Warpage Measurements of Electronic Packaging

Mold shrinkage and CTE mismatch leads to Warpage in Electronic Components. This application note shows how a DIC TCT system can be used to measure the Coefficient of Thermal Expansion (CTE) […]
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Application Scripting Module – Thermal Chip – Video

Here is an example of the thermal chip analysis applications modules for the measurement of the coefficient of thermal expansion (CTE) and warpage (contour and displacement).
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Basics of 3D Digital Image Correlation (DIC)

In classical image correlation the deformation of an object is determined by observation with a CCD camera. Then a digital image correlation process determines the shift and/or rotation and […]
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