In this application video, a 3-cam 12 Mpx ThermechDIC system is used to measure warpage,
specifically out-of-plane deformation with respect to a reference surface contour, of a BGA
Package in Istra4D V4.12. The BGA Package is placed on a temperature stage which heats
the sample up from room temperature (ca. 25°C) to 180°C. This is performed in two cycles,
the first, using a continuous ramp to the min/max limits, and the other, as a step-level ramp
with additional 75°C and 125°C levels.
In the measurement series playback mode, it is clear when zooming-in on the sample that
there is local movement with respect to the temperature state.
In the graphical visualization, the 2D-overlay of the total displacement (in microns) can be
seen, subtracting any rigid body motion (RBM) from the measurement. The maximum displacement
appears to be at the outer edges of the BGA Package to be approx. 48 microns. The visualization
of both surface contour and warpage, with respect to temperature, is much clearer using a
3D-model display. Selection of the 3D-grid display (again with any RBM removed) shows the
scaled shape of BGA Package at the various temperature levels, whereby it is clear a relationship
between amount of out-of-plane deformation and temperature level is dominant.
Within Istra4D, users can execute, ready-made, free-of-charge, application modules that perform
specific application analysis tasks. Within the Thermal-Mechanical Analysis Applications Package,
a custom-made module for “Warpage Analysis” can be initiated directly from the Istra4D software.
After importing the HDF5 data series and selection of the temperature states for analysis, the reference
state (more specifically coordinate system) can be defined either using; a best-fit plane or via 3-points.
A warpage comparison for the selected step, with respect to the reference step, can then be displayed.
Another approach is possible whereby line gauge elements can be placed over the data, for which the
intersected data is extracted – thenafter the warpage state can then be assessed relevant to gauge/s
and temperature.
RELATED SOLUTIONS
Subscribe to News
Get the Latest Information about:
| Products | Technologies |
| Applications | Special Offers |
