CTE & Warpage Measurements of Electronic Packaging

warpage analysis with DIC TCT

Mold shrinkage and CTE mismatch leads to Warpage in Electronic Components. This application note shows how a DIC TCT system can be used to measure the Coefficient of Thermal Expansion (CTE) and Warpage of Electronic Components.


More Information

To learn more about how Dantec Dynamics can help you solve your testing challenges, contact us today