Live webinar – Electronic Component (Testing) using Digital Image Correlation (DIC)

Join us to learn more on 22nd February, 2022
in the morning session at 09:30-11:00 (CET) or
in the afternoon session at 16:30-18:00 (CET)

Participation is free-of-charge and the webinar will take approximately 1.5 hours.

Dantec Dynamics is pleased to announce that we will be hosting a public webinar on „Electronic Component Testing using Digital Image Correlation (DIC)“ .The live webinar will take approximately 1.5 hours and at the end of the presentation you will understand the underlying DIC measurement principles & method and will be familiar with the many different successful applications of DIC in the field of electronic component testing.

Agenda

  • Introduction to Digital Image Correlation (DIC)
  • Dantec’s DIC product portfolio
  • Advantages of DIC compared to other measurement techniques
  • An overview of electronic (thermal) testing applications including;
  • Warpage measurements of semi-conductors
  • Strain & CTE measurements of solder balls (BGAs)
  • CTE measurements of Cu-ETP plates
  • Warpage & CTE measurements of SSD Drives
  • Q&A Session
  • Conclusion

This webinar is primarily intended for engineers and researchers in the field of R&D and quality control. A broad range of applications will be presented and reviewed, based on measurements performed by the 3D, full-field, high-precision Digital Image Correlation (DIC) technique.

Morning session @ 0930-1100 (CET) click to register

Afternoon session @ 1630-1800 (CET) click to register