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24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems – Eurosime 2023
Dantec Dynamics will be sponsoring and presenting at the Eurosime 2023 in Graz, Austria.
We will be showcasing a ThermechDIC and Stereomicroscope (µDIC) system where we present the advantages and technology of Digital Image Correlation (DIC) being used for strain, warpage, and coefficient of thermal expansion (CTE) measurements of electronic components.
Come by our booth and let us update you on our latest news.