The Istra4D DIC application scripting functionality allows users to initiate custom, numerical computations of application data series. This is performed via the integration of Dantec Dynamics’s DIC software, Istra4D, with open-source and free SciLabTM software for numerical computation through the Dantec Open Application Module Interface (DOAMI). This functionality allows users to utilize the powerful computing and visualization environment of SciLabTM, effectively allowing anything that has been measured to be numerically post-processed.
The materials testing applications package includes the following application modules:
Young’s Modulus – allowing users to plot the stress vs. strain curves, determine the Young’s Modulus, Yield Stress (& Strain), 0.2% Offset Stress (& Strain), Ultimate Tensile Stress (& Strain), Fracture Stress (& Strain) and Uniform (Proportional) Elongation (Ag). It also allows users the option of choosing the starting cross-section geometry (cylindrical or rectangular), dimensions and stress calculation method (engineering or true).
Poisson Ratio – allowing users to plot & determine the Poisson Ratio vs. Longitudinal Strain, Transversal vs. Longitudinal Strain and Strain vs. Time.
Strain Rate – allowing users to plot & determine the Strain vs. Time and Strain Rate vs. Time.
Plastic Strain Ratio – allowing users to plot & determine the True Strain in Length, True Strain in Thickness & Width and Plastic Strain Ratio using two methods of determination: 1) measured strain in thickness based on the minimum thickness of a parallel line and 2) calculated strain in thickness based on the conversion of strain in length and width by assuming a constant specimen volume.
The point tracking applications package includes the following application modules:
- Distance & angle change between two points
- Displacement, velocity and acceleration of one point element
- Relative displacement, velocity and acceleration between two point elements.
- Displacements (X, Y & Z) and relative displacements (X, Y & Z) between two points.
The vibration analysis applications package includes the following application module:
Modal shape analysis (FFT) for one point or multiple points. This module allows users to select one or more point on a surface, plot a diagram of displacement vs. time and perform a fast-fourier transformation (FFT) of the data to reveal the eigenfrequencies and eigenmodes.
The thermal chip applications package includes the following application modules:
CTE GUI allows users to determine the coefficient of thermal expansion (CTE) based on two or multiple different stable temperature stages with an automatic temperature stage finder. It will plot diagrams of the: Temperature (State) vs. Time of entire measurement series, Temperature (State) vs. Strain of entire measurement series, and Temperature (State) vs. Strain of selected stages with CTE calculation.
Warpage calculation (Z-Contour & Z-Displacement) of a chip at different temperature stages.