Application Scripting and Modules

The Istra4D DIC application scripting functionality allows users to initiate custom, numerical computations of application data series. This is performed via the integration of Dantec Dynamics’s DIC software, Istra4D, with open-source and free SciLabTM software for numerical computation through the Dantec Open Application Module Interface (DOAMI). This functionality allows users to utilize the powerful computing and visualization environment of SciLabTM, effectively allowing anything that has been measured to be numerically post-processed. 

Dantec scripting overview
Figure 1 – Istra4D DIC application scripting functionality overview
Istra4D Application modules
Figure 2 – Istra4D application modules (with QR Links to our DIC YouTube Channel)

The materials testing applications package includes the following application modules:

young's modulus and GUI
Figure 3 – Young’s Modulus GUI

Young’s Modulus – allowing users to plot the stress vs. strain curves, determine the Young’s Modulus, Yield Stress (& Strain), 0.2% Offset Stress (& Strain), Ultimate Tensile Stress (& Strain), Fracture Stress (& Strain) and Uniform (Proportional) Elongation (Ag). It also allows users the option of choosing the starting cross-section geometry (cylindrical or rectangular), dimensions and stress calculation method (engineering or true).

Poisson Ratio – allowing users to plot & determine the Poisson Ratio vs. Longitudinal Strain, Transversal vs. Longitudinal Strain and Strain vs. Time.

Strain Rate – allowing users to plot & determine the Strain vs. Time and Strain Rate vs. Time.

poisson ratio and strain rate
Figure 4 – Poisson ratio and strain rate graph with example
plastic strain ratio
Figure 5 – Plastic strain ratio graphs with example

Plastic Strain Ratio – allowing users to plot & determine the R-values using the ratio of true strain in the width to the true strain in the thickness when a specimen is pulled in uniaxial tension beyond its elastic limit. This approach assumes the volume is constant during the test and uses the true principal strains for calculation.


The point tracking applications package includes the following application modules:

  • Distance & angle change between two points
  • Displacement, velocity and acceleration of one point element
  • Relative displacement, velocity and acceleration between two point elements.
  • Displacements (X, Y & Z) and relative displacements (X, Y & Z) between two points.

distance change between two points
Figure 6 – Distance between two points


The thermal chip applications package includes the following application modules:

CTE GUI allows users to determine the coefficient of thermal expansion (CTE) based on two or multiple different stable temperature stages with an automatic temperature stage finder. It will plot diagrams of the: Temperature (State) vs. Time of entire measurement series, Temperature (State) vs. Strain of entire measurement series, and Temperature (State) vs. Strain of selected stages with CTE calculation.

cte gui
Figure 7 – CTE GUI
warpage
Figure 8 – Warpage

Warpage calculation (Z-Contour & Z-Displacement) of a chip at different temperature stages.


The Forming Limit Curve (FLC) (ISO 12004-2) includes the following application modules:

Plots a diagram of the Forming Limit Curve (FLC) and calculates the major (𝜀1) and minor (𝜀2) true strains according to ISO 12004-2 using one line gauge.

forming limit curves
Figure 9 – Forming Limit Curves (FLC) with measurement example

The Vibration Analysis (ODS, OMA & EMA) includes the following application modules

vibration analysis gui
Figure 10 – Vibration Analysis GUI

Determines the natural (resonant) frequencies and corresponding mode shapes using operational modal analysis (OMA), operation deflection & shape (ODS) analysis and experimental modal analysis (EMA)