Digital Image Correlation – DIC
Digital Image Correlation (DIC) is a 3D, full-field, non-contact optical technique to measure contour, deformation vibration and strain on almost any material.
It can be used for many tests including tensile, torsion, bending and combined loading for both static and dynamics applications.
The technique can be applied to small or large area testing and the results are readily comparable with FEA results or strain gauges.
|3D Full-field, Real-time display of displacement and strain overlaid on live image||Fast and easy automatic calibration procedure|
|Real-Time Correlation with analog voltage output – evaluate, display and output data in real-time for interfacing with other equipment||Multi-camera system for up to 360 degree measurement around an object and simultaneous front and back side measurements (thinning)|
|Measurement area <1mm up="" to="">1m||Online feedback of accuracy and quality|
|All data with a confidence margin (error approximation)||Full access to data using an open data format|
|Synchronous recording of analog data||Extended export and import - to FEA software for comparisons|
|Different coordinate systems||High speed cameras up to 1,000,000 frames/sec|
Contour, Deformation and Strain Measurement
Thermal Expansion Measurement on Electronic Components
Videoextensometer - Real Time Strain Sensor
Learn more about DIC
Digital Image Correlation (DIC) is a full-field image analysis method, based on grey value digital images, that can determine the contour and the displacements of an object under load in three dimensions. Read More
The flexible design opens a wide range of applications from microscopic investigations on microelectronic or biomedical materials up to large scale measurements of aerospace, automotive, marine and railway components. Read More