PRODUCTS & SERVICES
PRODUCTS & SERVICES Strain/Stress & Vibration
 

Strain & Stress Measurements

Optical measurement solutions for strain & stress measurements, based on Electronic Speckle Pattern Interferometry (ESPI) and Digital Image Correlation (DIC)

 

 

 FEM Simulation

Effective development of advanced materials and components requires an understanding of their behaviour under load at various conditions. Optical full-field measurement techniques are increasingly being used in material testing, fracture mechanics and vibration analysis.

The Dantec Dynamics ESPI and Digital Image Correlation Systems are designed for complete three dimensional, full field and highly sensitive displacement and strain analysis.

The measurement is performed non-contact on the whole measuring area on nearly any material and component.

 
 
 
Image Correlation System Q-400
  Digital 3D Image Correlation System Q-400
The flexible designed correlation system opens a wide range of applications: automotive, marine, railway etc.

 

ESPI Sensor Q-100
  Strain Sensor Q-100
Unique device for strain measurement, especially for fast component testing.

 

ESPI System Q-300
  3D ESPI System Q-300
Designed for 3D highly sensitive measurement analysis for complex materials structure.

 

ESPI System Q-300 TCT
  3D ESPI System Q-300 TCT
Intended for thermal expansion measurement and strain analysis of electronic components.
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