PRODUCTS & SERVICES
PRODUCTS & SERVICES Strain/Stress & Vibration
 

Optical Strain/Stress and Vibration Measurements

 

 

 

The characterization of new materials and joints produces new challenges for measuring techniques:

True strain - true stress, Young's modulus, Poisson's ratio, longitudinal and transverse strains, etc. have to be simultaneously determined with high resolution and at many thousands of measurement points.

 

Dantec Dynamics offers new solutions that provide instant full-field, three-dimensional measurements at each of more than one million points within the field of view, quickly, easily, with no surface preparation or sensor attachment.

The Dantec Dynamics' Correlation and 3D ESPI  systems deliver all this data with the push of one button:

Strain & Stress Measurement

 

 

Digital Image Correlation
  Correlation System Q-400
Flexible design for a wide range of applications
 
 
ESPI Sensor Q-100
  Strain Sensor Q-100
Especially designed for fast component testing
 
ESPI System Q-300
  3D ESPI System Q-300
High sensitive displacement and strain analysis
   
3D ESPI System Q-300 TCT
  3D ESPI System Q-300 TCT
Thermal expansion measurement of electronic components
 
 

Vibration Analysis

 

Component vibration design requires full-field information of single component and assembly modes.

The Dantec Dynamics vibration measuring systems replace single point accelerometers and sensor attachment, or mass loading, delivers three dimensional vibration modes including in- and out-of plane components of the vibration within seconds after the test.

 

 

High Speed Digital Image Correlation
  High Speed Correlation
Q-450

Measurement and analysis of dynamic events
 
Vibro ESPI System Q-500
  3D Vibro-ESPI Q-500
Complete 3D high sensitive vibration analysis
     

 

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